Kingston HyperX Fury 8GB DDR4 2666MHz CL16 Black Desktop Memory (HX426C16FB3/8)

Kingston HyperX Fury 8GB DDR4 2666MHz CL16 Black Desktop Memory (HX426C16FB3/8)
Regular price ₱1,794.00
OVERVIEW:

HX426C16FB3/8
8GB (4GB 512M x 64-Bit x 2 pcs.)
DDR4-2666 CL15 288-Pin DIMM

DESCRIPTION
HyperX HX426C15FBK2/8 is a kit of two 512M x 64-bit (4GB)
DDR4-2666 CL15 SDRAM (Synchronous DRAM) 1Rx8, memory
module, based on eight 512M x 8-bit FBGA components per
module. Each module kit supports Intel® Extreme Memory
Profiles (Intel® XMP) 2.0. Total kit capacity is 8GB. Each
module has been tested to run at DDR4-2666 at a low latency timing
of 15-17-17 at 1.2V. Additional timing parameters are shown in
the Plug-N-Play (PnP) Timing Parameters section below.
The JEDEC standard electrical and mechanical specifications
are as follows:

SPECIFICATIONS
CL(IDD) 15 cycles
Row Cycle Time (tRCmin) 45ns(min.)
Refresh to Active/Refresh 260ns(min.)
Command Time (tRFCmin)
Row Active Time (tRASmin) 26.25ns(min.)
Maximum Operating Power TBD W*
UL Rating 94 V - 0
Operating Temperature 0o C to +85o C
Storage Temperature -55o C to +100o C


JEDEC/XMP TIMING PARAMETERS
• JEDEC/PnP: DDR4-2666 CL15-17-17 @1.2V
DDR4-2400 CL14-16-16 @1.2V
DDR4-2133 CL12-14-14 @1.2V
•XMP Profile #1: DDR4-2666 CL15-17-17 @1.2V

FEATURES
• Power Supply: VDD = 1.2V Typical
• VDDQ = 1.2V Typical
• VPP - 2.5V Typical
• VDDSPD = 2.2V to 3.6V
• Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
• Low-power auto self refresh (LPASR)
• Data bus inversion (DBI) for data bus
• On-die VREFDQ generation and calibration
• Single-rank
• On-board I2 serial presence-detect (SPD) EEPROM
• 16 internal banks; 4 groups of 4 banks each
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
• Fly-by topology
• Terminated control command and address bus
• Height 1.340” (34.04mm), w/heatsink
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HX426C16FB3/8
8GB (4GB 512M x 64-Bit x 2 pcs.)
DDR4-2666 CL15 288-Pin DIMM

DESCRIPTION
HyperX HX426C15FBK2/8 is a kit of two 512M x 64-bit (4GB)
DDR4-2666 CL15 SDRAM (Synchronous DRAM) 1Rx8, memory
module, based on eight 512M x 8-bit FBGA components per
module. Each module kit supports Intel® Extreme Memory
Profiles (Intel® XMP) 2.0. Total kit capacity is 8GB. Each
module has been tested to run at DDR4-2666 at a low latency timing
of 15-17-17 at 1.2V. Additional timing parameters are shown in
the Plug-N-Play (PnP) Timing Parameters section below.
The JEDEC standard electrical and mechanical specifications
are as follows:

SPECIFICATIONS
CL(IDD) 15 cycles
Row Cycle Time (tRCmin) 45ns(min.)
Refresh to Active/Refresh 260ns(min.)
Command Time (tRFCmin)
Row Active Time (tRASmin) 26.25ns(min.)
Maximum Operating Power TBD W*
UL Rating 94 V - 0
Operating Temperature 0o C to +85o C
Storage Temperature -55o C to +100o C


JEDEC/XMP TIMING PARAMETERS
• JEDEC/PnP: DDR4-2666 CL15-17-17 @1.2V
DDR4-2400 CL14-16-16 @1.2V
DDR4-2133 CL12-14-14 @1.2V
•XMP Profile #1: DDR4-2666 CL15-17-17 @1.2V

FEATURES
• Power Supply: VDD = 1.2V Typical
• VDDQ = 1.2V Typical
• VPP - 2.5V Typical
• VDDSPD = 2.2V to 3.6V
• Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
• Low-power auto self refresh (LPASR)
• Data bus inversion (DBI) for data bus
• On-die VREFDQ generation and calibration
• Single-rank
• On-board I2 serial presence-detect (SPD) EEPROM
• 16 internal banks; 4 groups of 4 banks each
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
• Fly-by topology
• Terminated control command and address bus
• Height 1.340” (34.04mm), w/heatsink
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